preliminary description the LZ34B1B is a 1/4-type (4.5 mm) solid-state color image sensor that consists of pn photo- diodes and cmos (complementary metal oxide semiconductor) devices. the sensor further includes a timing generator (tg), a correlated double sampling (cds) circuit, an auto gain control (agc) circuit and an analog-to-digital converter (adc) circuit. with approximately 350 000 pixels (703 horizontal x 499 vertical), the sensor provides a stable digital color image with extremely low power consumption. features ? progressive scan ? square pixel ? compatible with vga standard ? number of image pixels : 655 (h) x 493 (v) ? number of optical black pixels C horizontal : 24 front and 24 rear C vertical : 3 front and 3 rear ? pixel pitch : 5.6 m (h) x 5.6 m (v) ? r, g, and b primary color mosaic filters ? image inversion function (horizontally and/or vertically) ? available for two types of power save mode C agc and ad circuits become power-off with serial data C all circuits become power-off with stby pin ? monitoring mode ? analog output and 8-bit digital output ? variable gain control (3 to 30 db) ? variable electronic focal plane shutter (1/15 to 1/7 875 s) ? single +2.8 v power supply ? package : 36-pin lcc * (n-lcc036-s425b) * leadless chip carrier pin connections precautions ? refer to "precautions for cmos image sensors" . LZ34B1B 1 LZ34B1B 1/4-type color cmos image sensor with 350 k pixels bias 1 agcout agnd av dd ofs adl adh nc stby 1 2 3 4 5 6 7 8 9 agnd av dd dgnd dv dd cki cko d 0 d 1 d 2 10 11 12 13 14 15 16 17 18 sdi vd hd clk d 7 d 6 d 5 d 4 d 3 nc refin bias 2 sigin sigout clp 1 clp 2 load sclk 27 26 25 24 23 22 21 20 19 36 35 34 33 32 31 30 29 28 36-pin lcc top view (n-lcc036-s425b) in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before using any sharp devic e. back
preliminary LZ34B1B 2 block diagram hd, vd clk tg agc control agc cmos image sensor analog video out agc out 8-bit d/a 8-bit a/d digital video out data
preliminary LZ34B1B 3 pin no. symbol i/o description 35 refin i reference voltage for analog input analog a/d analog digital ground C av dd 11 analog analog power supply C agnd 10 digital analog ground i stby 9 C standby control mode * C nc 8 analog no connection C adh 7 analog top adc reference voltage C adl 6 analog bottom adc reference voltage C ofs 5 analog offset bias voltage for agc output C av dd 4 analog analog power supply C agnd 3 analog analog ground o agcout 2 analog agc output C bias 1 1 C no connection C nc 36 analog bias voltage 1 for image sensor 12 dgnd C digital digital i sdi 27 control data input (agc gain, offset, shutter control, image inversion, etc.) digital i vd 26 vertical drive pulse input digital i hd 25 horizontal drive pulse input digital o clk 24 clock output (6.135 mhz) digital o d 7 23 adc signal output (msb) digital o d 6 22 adc signal output digital o d 5 21 adc signal output digital o d 4 20 adc signal output digital o d 1 17 adc signal output digital o cko 15 clock output for oscillator digital i cki 14 clock input for oscillator (12.27 mhz) digital C dv dd 13 digital power supply analog bias voltage 2 for image sensor 34 * standby mode functions high level : standby mode (all circuits power-off), low level or open : normal mode (all circuits active) bias 2 C analog analog image signal input 33 sigin i analog analog image signal output 32 sigout o analog analog bias voltage 1 for clamp circuit 31 clp 1 C analog analog bias voltage 2 for clamp circuit 30 clp 2 C analog load pulse for data input 29 load i digital shift clock for data 28 sclk i digital pin description adc signal output (lsb) 16 d 0 o digital adc signal output 18 d 2 o digital digital o d 3 19 adc signal output
preliminary LZ34B1B 4 absolute maximum ratings (t a = +25 ?c) parameter symbol power supply voltage v dd input signal voltage v ? C0.3 to v dd + 0.3 C0.3 to +4.6 rating unit v v ?c C40 to +80 t stg storage temperature parameter symbol power supply voltage v dd operating temperature t opr C20 2.6 min. unit v ?c typ. max. 2.8 3.0 +25 +50 recommended operating conditions 12.27 mhz f ck oscillation frequency (connect to pin through a capacitor) analog input voltage digital input voltage v ?l 0v 0.2v dd low level high level analog bias voltage (connect to gnd through a capacitor) v ?h 0.8v dd v dd v 3 1 2 note notes : 1. applied to input pins stby, hd, vd, sdi, sclk and load. 2. applied to input pins sigin and refin. do not connect to dc directly. 3. applied to pins bias 1 , bias 2 , ofs, adl, adh, clp 1 and clp 2 . do not connect to gnd directly. normal mode monitoring mode
preliminary LZ34B1B 5 characteristics (1/15 s progressive scan readout mode) (t a = +25?c, operating conditions : the typical values specified in "recommended operating conditions" . color temperature of light source : 3 200 k, ir cut-off filter (cm-500, 1mmt) is used.) ? measurement point : analog image signal output (pin no.32), before agc circuit and ad converter. standard output voltage v o photo response non-uniformity prnu saturation output voltage v sat v dark sensitivity (green channel) r (g) supply current i vdd parameter symbol note dark output voltage vfpn vertical line fixed pattern noise min. 400 250 0.5 13 150 700 2 typ. max. 14 1 4 3 2 mv mvp-p ma mv % mv mv unit 5 6 8 150 1.1 3 notes : 1. the average output voltage of g signal under uniform illumination. the standard exposure conditions are defined as when v o is 150 mv. 2. the image area is divided into 10 x 10 segments under the standard exposure conditions. each segment's voltage is the average output voltage of all pixels within the segment. prnu is defined by (vmax C vmin)/v o , where vmax and vmin are the maximum and minimum values of each segment's voltage respectively. 3. the image area is divided into 10 x 10 segments. each segment's voltage is the average output voltage of all pixels within the segment. v sat is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 4. the difference between average output voltage of the image area and that of the ob area, under non- exposure conditions. 5. the average output voltage of g signal when a 500 lux light source with a 90% reflector is imaged by a lens of f4, f50 mm. 6. total current of analog and digital power supplies, in the dark and at the standard load conditions. 7. total current of power supply in standby mode. (pin no.9 (stby) is fixed to "h" level and other input pins are fixed to "h" level or "l" level.) 8. one mean horizontal line signal is obtained by adding all the horizontal line signals vertically and dividing them by the line number. is the deviation of the center pixel from the average of successive 5 pixels in . vfpn is the maximum absolute value of . standby current i stby 1a7 10
preliminary LZ34B1B 6 pixel structure 1 pin optical black (3 pixels) optical black (24 pixels) optical black (24 pixels) optical black (3 pixels) 655 (h) x 493 (v) color filter array (1, 493) (655, 493) (1, 1) (655, 1) r g r g r g g r g r g r b g b g b g g r g r g r g r g r g r b g b g b g g r g r g r b g b g b g g r g r g r g r g r g r b g b g b g g b g b g b r g r g r g r g r g r g g b g b g b r g r g r g g b g b g b r g r g r g r g r g r g g b g b g b
preliminary LZ34B1B 7 timing chart [normal mode] clk adout (d 0 -d 7 ) normal hd clk adout (d 0 -d 7 ) 776 4 8 12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 88 92 horizontal pulse timing phase relations between digital output (adout) and clock (clk) vertical pulse timing mirror 10 5 clk adout (d 0 -d 7 ) normal hd 74 78 82 86 90 94 98 102 106 110 114 118 122 126 130 134 138 142 146 150 154 158 162 166 170 ob 1 ob 510152025303540 mirror adout (d 0 -d 7 ) normal mirror 780 hd sclk sdi agc vd 524 525 123456789101112131415161718192021222324252627282930313233343536 sdi, sclk, load forbidden period 37 38 6 5 4 3 2 1 ob ob ob 7 39 523 493 ob ob ob 492 d 0 d 10 d 20 d 30 d 37 symbol min. typ. max. unit ?t 45 ns 488 489 490 491 492 493 ob ob ob 487 1 ob ob ob 2 load serial data timing (sdi, sclk, load) fixed gain shutter offset ?t 01 2 ? the rising edge of the hd pulse must be between two rising edges of clk (0) and clk (1). ? the falling edge of the hd pulse must be between two rising edges of clk (78) and clk (79). ? the rising edge and falling edge of the vd pulse must be in high period of the hd pulses. ? data in sdi are taken at the rising edge of sclk. ? clock frequency of sclk should be less than 1/2 of that of clk. ? do not insert the sdi, sclk and load pulses between 28h * and 29h * . refer to " vertical pulse timing ". ? refer to "serial data inputs" for the contents of serial data from d 0 to d 37 . * it means ordinal number of the hd pulse. 645 650 ob 655 ob 650 645 640 635 630 625 620 615 ob ob ob 1 ob 655
preliminary LZ34B1B 8 [monitoring mode] clk adout (d 0 -d 7 ) normal hd clk adout (d 0 -d 7 ) 776 4 ob ob 8 121620242832364044485256606468727680848892 horizontal pulse timing phase relations between digital output (adout) and clock (clk) vertical pulse timing ob ob mirror 10 5 1 clk adout (d 0 -d 7 ) normal hd 74 78 82 86 90 94 98 102 106 110 114 118 122 126 130 134 138 142 146 150 154 158 162 166 170 mirror adout (d 0 -d 7 ) normal mirror 780 hd sclk sdi agc vd 261 262 123456789101112131415161718192021222324252627282930313233343536 sdi, sclk, load forbidden period 37 38 41 38 37 34 33 30 29 26 25 22 21 18 17 14 13 10 9 6 5 2 1 ob 42 260 489 490 493 ob 486 d 0 d 10 d 20 d 30 d 37 symbol min. typ. max. unit ?t 45 ns 453 456 457 460 461 464 465 468 469 472 473 476 477 480 481 484 485 488 489 492 493 ob 452 541 ob 8 load serial data timing (sdi, sclk, load) fixed gain shutter offset ?t 01 2 ? the rising edge of the hd pulse must be between two rising edges of clk (0) and clk (1). ? the falling edge of the hd pulse must be between two rising edges of clk (78) and clk (79). ? the rising edge and falling edge of the vd pulse must be in high period of the hd pulses. ? data in sdi are taken at the rising edge of sclk. ? clock frequency of sclk should be less than 1/2 of that of clk. ? do not insert the sdi, sclk and load pulses between 15h * and 16h * . refer to " vertical pulse timing ". ? refer to "serial data inputs" for the contents of serial data from d 0 to d 37 . * it means ordinal number of the hd pulse. 645 650 655 ob 1 ob 510152025303540 ob 655 ob 650 645 640 635 630 625 620 615
preliminary LZ34B1B 9 serial data inputs data name function d 0 agc 6 (msb) auto gain control (0 to 20 db) d 1 agc 5 d 2 agc 4 d 3 agc 3 d 4 agc 2 d 5 agc 1 d 6 agc 0 (lsb) d 7 d 8 max 2 (msb) d 9 max 1 d 10 max 0 (lsb) selection of fixed gain (3 to 10 db) not used. (fix to low level.) d 11 ofs 7 (msb) d 12 ofs 6 d 13 ofs 5 offset level control of adc (0.9 to 1.5 v) d 14 ofs 4 d 15 ofs 3 d 16 ofs 2 d 17 ofs 1 d 18 ofs 0 (lsb) d 19 sht 9 (msb) d 20 sht 8 d 21 sht 7 shutter speed control (normal mode : exposure time is 1 to 1/525 frame period.) (monitoring mode : exposure time is 1 to 1/262 frame period.) d 22 sht 6 d 23 sht 5 d 24 sht 4 d 25 sht 3 d 26 sht 2 d 27 sht 1 d 28 sht 0 (lsb) d 29 mirh d 30 mirv d 31 mon h : horizontal mirror inversion image, l : normal image d 32 sad 2 (msb) phase selection of ad clock d 32 /d 33 /d 34 = l/l/l : C30? d 32 /d 33 /d 34 = l/l/h : C15? d 32 /d 33 /d 34 = l/h/l : 0? d 32 /d 33 /d 34 = l/h/h : +15? d 33 sad 1 d 34 sad 0 (lsb) d 35 lpmd 1 power save mode d 35 /d 36 = l/l : normal mode d 35 /d 36 = l/h : ad and agc off d 35 /d 36 = h/l : ad off d 35 /d 36 = h/h : inhibited mode d 36 lpmd 0 d 37 usb h : inhibited mode, l : normal mode h : vertical mirror inversion image, l : normal image h : monitoring mode, l : normal mode
preliminary LZ34B1B 10 setting of auto gain control ? one lsb of the gain code represents approximately 0.156 db. ? nominal gain values at typical codes are shown below. auto gain control (db) d 0 d 1 d 2 d 3 d 4 0lllll 1llllh 2lllhh 3llhll 4llhhl 5lhlll 6lhllh 7lhlhh 8lhhll 9lhhhl 10 h l l l l 11 h l l l h 12 h l l h h 13 hlhll 14 h l h h l 15 h l h h h 16 h h l l h 17 h h l h h 18 h h h l l 19 hhhhl 20 hhhhh h h h l l h h h l l l h h l l l h h h l l d 6 h l h l h h l h l h l l h l h l l h l h l d 5 setting of fixed gain ? one lsb of the gain code represents 1 db. fixed gain (db) d 9 d 10 3ll d 8 l 4lh l 5hl l 6hh l 7ll h 8lh h 9hl h 10 h h h
preliminary LZ34B1B 11 setting of driving modes function normal mode l d 31 l monitoring mode l h d 37 setting of offset level ? one lsb of the offset code represents approximately 0.002 v. ? nominal offset values at typical codes are shown below. offset level (v) d 11 d 12 d 13 d 14 d 15 d 16 d 17 d 18 0.9 llllllll 1.0 llhlhlhh 1.1 lhlhlhlh 1.2 hlllllll 1.3 hlhlhlhl 1.4 hhlhlhlh 1.5 hhhhhhhh setting of shutter speed ? one lsb of the shutter speed code represents 1h, where 1h is the hd pulse period. ? shutter speed values at typical codes are shown below in normal mode, monitoring mode and usb mode. shutter speed (exposure time unit : h) 525 d 19 l normal monitoring ? ? 265 264 263 ? ? 27 26 25 ? ? 2 1 525 ? ?? ? 262 262 262 ? ? 262 262 262 ? 262 ? 1 2 ? ? 262 262 525 d 20 d 21 d 22 d 23 d 24 d 25 d 26 d 27 d 28 l l l l l l h h h hhhhhhhhhh lllllhhlh lllllhhll lllllhlhh hhhhhlhl l hhhhhl lhh hhhhhl lhl hlllllhhl hlllllhlh hlllllhll lllllllll
preliminary LZ34B1B 12 example of operation circuit d 3 d 4 d 5 d 6 d 7 clk hd vd sdi stby nc adh adl ofs av dd agnd agcout bias 1 sclk load clp 2 clp 1 sigout sigin bias 2 refin nc (6.135 mhz) oscillator (12.27 mhz) 10 f + 10 f + digital power supply analog power supply d 2 d 1 d 0 cko cki dv dd dgng av dd agnd LZ34B1B (top view) 19 20 21 22 23 24 25 26 27 9 8 7 6 5 4 3 2 1 18 17 16 15 14 13 12 11 10 28 29 30 31 32 33 34 35 36 ? insert capacitors more than 10 f between av dd and agnd and between dv dd and dgnd. ? capacitors whose values are not shown must be 0.1 f.
LZ34B1B 13 9.8 0.1 (?2) center of effective imaging area 0.7 typ. aa' 1.2 0.12 1.9 0.2 5.4 0.075 1.05 0.1 0.85 0.1 package cmos a a' 0.7 0.1 (?2) 0.5 0.35 0.65 6.05 0.075 0.5 0.35 center of die. center of die refractiva index : nd = 1.5 refractive index : nd = 1.5 rotation error of die : ? 1.5? max. (?1 : effective imaging area) (?2 : lid' size) 27 19 9 1 28 36 10 18 ? glass lid 0.04 (?1) 0.04 (?1) 0.4 typ. index mark index mark 19 18 10 28 36 36 27 91 r0.15 typ. 1.27 typ. 0.1 typ. 0.6 typ. p-1.0 typ. r0.4 typ. 10.8 0.1 36 lcc (n-lcc036-s425b) (unit : mm) package outlines
LZ34B1B 14 precautions for cmos image sensors 1. package breakage in order to prevent the package from being broken, observe the following instructions : 1) the cmos image sensor is a precise optical component and the package material is ceramic. therefore, ? take care not to drop the device when mounting, handling, or transporting. ? avoid giving a shock to the package. especially when pins are fixed to the socket or the circuit board, small shock could break the package more easily than when the package isnt fixed. 2) when mounting the package on the housing, be sure that the package is not bent. C if a bent package is forced into place between a hard plate or the like, the pack- age may be broken. 3) if any damage or breakage occurs on the sur- face of the glass cap, its characteristics could deteriorate. therefore, ? do not hit the glass cap. ? do not give a shock large enough to cause distortion. ? do not scrub or scratch the glass surface. even a soft cloth or applicator, if dry, could cause flaws to scratch the glass. 2. electrostatic damage as compared with general mos-lsi, cmos image sensor has lower esd. therefore, take the following antistatic measures when handling the cmos image sensor : 1) always discharge static electricity by grounding the human body and the instrument to be used. to ground the human body, provide resistance of about 1 m$ between the human body and the ground to be on the safe side. 2) when directly handling the device with the fingers, hold the part without pins and do not touch any pin. 3) to avoid generating static electricity, a. do not scrub the glass surface with cloth or plastic. b. do not attach any tape or labels. c. do not clean the glass surface with dust- cleaning tape. 4) when storing or transporting the device, put it in a container of conductive material. 3. dust and contamination dust or contamination on the glass surface could deteriorate the output characteristics or cause a scar. in order to minimize dust or contamination on the glass surface, take the following precautions : 1) handle the cmos image sensor in a clean environment such as a cleaned booth. (the cleanliness level should be, if possible, class 1 000 at least.) 2) do not touch the glass surface with the fingers. if dust or contamination gets on the glass surface, the following cleaning method is recommended : ? dust from static electricity should be blown off with an ionized air blower. for anti- electrostatic measures, however, ground all the pins on the device before blowing off the dust. ? the contamination on the glass surface should be wiped off with a clean applicator soaked in isopropyl alcohol. wipe slowly and gently in one direction only. frequently replace the applicator and do not use the same applicator to clean more than one device. ? note : in most cases, dust and contamination are unavoidable, even before the device is first used. it is, therefore, recommended that the above procedures should be taken to wipe out dust and contamination before using the device.
LZ34B1B 15 4. other 1) soldering should be manually performed within 2 seconds per pin at 400c maximum at the tip of soldering iron. 2) avoid using or storing the cmos image sensor at high temperature or high humidity as it is a precise optical component. do not give a mechanical shock to the cmos image sensor. 3) do not expose the device to strong light. for the color device, long exposure to strong light will fade the color of the color filters.
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